DESCRIPTION |
| Lingsen MEMS Pressure Sensor is a wire bonded and Lid seal on pre-mold lead-frame in package. MEMS(Micro Electro-Mechanical system) pressure sensor can be used in medical Instrumentation products etc. |
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APPLICATIONS |
| ● Medical Instrumentation Altimeter Weather ForecastTire GaugePressure GaugeIndustrial SensorHome Appliances |
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FEATURES |
| ● Low Cost. |
| ● Gauge Version and Absolute Version. |
| ● Constant Current or Constant Voltage Drive. |
| ● High Output. |
| ● Wide Pressure Range Available from 1psi to 60psi. |
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SPECIFICATIONS |
| ● Gold Wire: 99.99%Au. |
| ● Pre-Mold Compound: PPS/LCP. |
| ● Plating: NiAu. |
| ● Marking: Laser. |
| ● Packing: Antistatic Tube. |
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DEFINITION
| Assembly type: |
| 1.DIP (Dual In Line Package) |
| 2.SOP (Small Outline Package) |
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RELIABILITY
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THERMAL PERFORMANCE |
| Package |
Body size |
Pad size |
Die size |
Thermal Performance ψja |
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(mm) |
(mm) |
(mm) |
(°C/W) |
| DIP06UNS |
7.2x7.2 |
3.5x3.1 |
1.9x1.9x0.54 |
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| SOP06UNSP |
7x7 |
3.5x3.1 |
1.9x1.9x 0.54 |
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| Note: Simulated with JEDEC Standard 4-layer test board and 51-series under still air condition, ambient temperature 45°C. |
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ELECTRICAL PERFORMANCE |
| Package |
Body size |
Pad size |
Frequency |
Self inductance |
Self capacitance |
Resistance |
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(mm) |
(um) |
(MHz) |
(nH) |
(pF) |
(mohm) |
| DIP06UNS |
7.2x7.2 |
3.5x3.1 |
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| SOP06UNSP |
7x7 |
3.5x3.1 |
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| Note: Results are simulated. Data is available through 1GHz. Follow JEDEC standard 51-series. |
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CROSS-SECTION
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