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Analysis Procedure
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| Analysis method |
Capability |
| Visual inspection |
Up to 2000X Magnification Optical Inspection |
| X-ray inspection |
Real time Micro-focus X-ray |
| SAT |
Non-destructive detection of delamination, void, crack…. (15MHz, 30MHz, 50MHz, 100MHz) |
| Open/short |
<192pins package |
| X-section |
Package Cross-sectioning |
| De-cap |
Encapsulation removal by Chemical etching ( Au & Cu & Ag & Al wire) |
| SEM |
X18~x300000,30KV 3.5nm |
| EDS |
Surface Composition Analysis / depth>1um |
| Cratering Test |
Au & Cu & Ag & Al wire bond |
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