• 取得 Adobe Flash 播放程式
    •  
      •  
        Test Items
        Test Item Method Test Condition ( Standard ) Sample Size
        1.
        		 Precondition for Reliability Test JESD 22-A113 TC 5 cycles, Bake 125°C, 24hrs, Moisture Soak IR Reflow 3 cycles(SMDs) N=125, AC=0, RE=1
        2.
        		 High Temperature Storage Test JESD 22-A103 150°, 1000hrs N=22, AC=0, RE=1
        3.
        		 Pressure Cooker Test JESD 22-A102 121°C,2atm,100%R.H.,168hrs N=22,AC=0,RE=1
        4.
        		 Temperature & Humidity Test JESD 22-A101 85°C/85%R.H.,1000hrs N=22,AC=0,RE=1
        5.
        		 Temperature Cycling Test JESD 22-A104 -65°C~+150°C,500cycles N=22,AC=0,RE=1
        6.
        		 HAST JESD 22-A118 130°C,85%R.H.,100hrs without bias N=22,AC=0,RE=1
        7.
        		 Moisture Sensitivity Test J-STD-020 Bake 24H,Moisture Soak,IR Reflow N=22/level,AC=0,RE=1
        8.
        		 Solder ability Test JESD 22-B102 Dip&Look:Aging 8hrs,245±5°C,5±0.5sec Reflow Simulated use testing N=5/method,AC=0,RE=1
        9.
        		 Mark Permanency Test JESD 22-B107 Tape:3M Tape JESD 22-B107 SOLVENT C N=5/method,AC=0,RE=1
        10.
        		 Physical Dimensions JESD 22-B100 Per Outline Drawing N=5,AC=0,RE=1
        11.
        		 Lead Fatigue Test JESD 22-B105 90°C,8oz for P-DIP/SKINNY
        3oz for SOP/SOJ/PLCC/QFP, 2oz for SSOP/TSOP/TSSOP/SOT and others        		 N=5,AC=0,RE=1
        12.
        		 Resistance to Soldering Temperature JESD 22-B106 1. 270°C, 7+2/-0sec, only for through-hole devices
        2. Solder iron test: 400°C; 5±1sec        		 N=22/method,AC=0,RE=1