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      • MMIC

        DESCRIPTION

        Lingsen MEMS Microphone is a wire bonded and cap seal on substrate system in package. It will possess light, thin, short and small advantage. MEMS(Micro Electro-Mechanical system) Microphone can be used in communication and consumption products etc..

        		  
        SPECIFICATIONS
        Gold Wire 99.99% Au
        Cap Plastic and Metal
        Marking Laser Mark
        Packing Tray
        APPLICATIONS
        • ● Note-Book、 Multimedia Monitor
        • ● Cellular Phone 、Bluetooth、Hearing Aid
        		  
        FEATURES
        • ● Miniaturization
        • ● Automatic assembly
        • ● Full in-house design and test capability
        RELIABILITY
        MSL JEDEC Level 3C@260°C
        High Temperature Storage 168hrs(105°C)
        Low Temperature Storage 168hrs(-40°C)
        Temperature & Humidity 168hrs(60°C,60%RH)
        Thermal Shock Test 100 cycles(-40/125°C, 15min soaks＜30sec ramps)
        Mechanical Shock Test 10,000 G shocks, 5 impacts along each of 6 axes
        Vibration Test Sinusoidal vibration, 20-2000Hz, 4min sweeps, 16min along each of 3axes, amplitude limits of 20G and 0.06"
        Electro Static Discharge Human body model, ±2000V Machine model, ±200V
        ELECTRO-ACOUSTIC PERFORMANCE
        MMIC0064737T(4.72x3.76x1.76mm)Package
        Parameter Range Unit
        Directivity Omni-directional N/A
        Signal to Noise Ratio (SNR) 57 (fin=1kHz) dB
        Sensitivity -27~-21(1kHz, 94dB SPL) dBFS
        Total Harmonic Distortion+ Noise (THD+N) 5 (115dB SPL ,fin=1kHz) Max. %

        MMIC0044737M2T(4.72x3.76x1.15mm)Package
        Parameter Range Unit
        Directivity Omni-directional N/A
        Signal to Noise Ratio (SNR) 55~59(@1kHz) dB
        Sensitivity -46~-38(@1kHz, 94dB SPL) dBFS
        Total Harmonic Distortion+ Noise (THD+N) (At 100dB SPL)THD<1
        (At 115dB SPL)THD10        		 %

        CROSS-SECTION