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      • LTCC
        Low Temperature Co-Fired Ceramic Package

        DESCRIPTION

        Lingsen LTCC package is a ceramic substrate based plastic package It is available in pin count from 4 to higher pin counts based on the size of designed substrate. It is ideal to be used in the packaging of RF, wireless, blue tooth, portable as well as high-end networking and computing applications products.
        APPLICATIONS
        • ● RF/ Wireless/ Blue tooth/ GPS
        • ● Networking and computing applications products.
        		  
        SPECIFICATIONS
        • ● Epoxy./ Pb free solder
        • ● Gold Wire: 99.99%Au.
        • ● Marking: Laser Mark
          Packing: Tray
        FEATURES
        • ● Low profile
        • ● Package body size is flexible by substrate design
        • ● JEDEC standard compliant
        CROSS-SECTION