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      • OPLGA
        Optical Land Grid Array Package

        DESCRIPTION

        LINGSEN’s Optical Land Grid Array (OPLGA) package is a clear-plastic- encapsulated package. OPLGA is suitable for the lighting and optical sensor device of the visible and IR application. The package molded on BT substrate is benefit to mass production. The leads of OPLGA are located around the bottom periphery of the package to provide short electrical connection to the PWB.

        		  
        SPECIFICATIONS
        Substrate BT, thickness = 0.56 mm
        Gold Wire 99.99% Au
        Mold Compound NT-330HQ-10000 (Green)
        1 Transittance ≧90% @ wavelength≧400nm
        1 Lead Au Plated Foot Print
        Marking White Ink
        Packing Tube
        APPLICATIONS
        • ● Storage Products
        • ● DVD Reader
        • ● Lighting and Optical Sensor Products
        		  
        RELIABILITY
        MSL Level JEDEC Level 3 @ + 255°C
        Temperature Cycling 500 cycles (-40°C /85°C)
        Temperature & Humidity Test 1,000 hrs (60°C/90%RH)
        High Temperature Storage 500 hrs (85°C)
        Low Temperature Storage 500 hrs (-40°C)
        FEATURES
        • ● Clear Mold Compound
        • ● Visible and IR Application
        • ● BT Substrate
        • ● Small and Thin scale
        • ● Full In-house design capability
        PACKAGE AVAILABILITY
        Package Body Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        OPLGA 6L 2.35x1.8 1x0.8855x0.2032 132.18
        Note: Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        OPLGA 6L 2.35x1.8 100 1.170x1.277 0.185x0.478 52.154x63.900
        Note:Results are simulated. Data is available through 1GHz.
        CROSS-SECTION