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      • OLCC
        Organic Land Chip Carrier Package

        DESCRIPTION

        LINGSEN’s Organic Land Chip Carrier (OLCC) package is an AR glass- capped package of BT substrate. With AR-glass, OLCC provides the excellent transmittance for the lighting and optical sensor device of the visible application. The leads of OLCC are located around the bottom periphery of the package to provide short electrical connection to the PWB.

        APPLICATIONS
        • ● Storage products:
          DVD Reader
          Blue Ray DVD reader
        • ● Optical products:
          CMOS camera
         
        SPECIFICATIONS
        Substrate: BT, thickness= 1.01 mm
        Gold Wire: 99.99%Au
        Glass: AR Glass. AR film deposited on one or both sides.
        Transmittance: Average>99% @ wavelength=400~700nm
        Lead: Au Plated Foot Print
        Marking: White Ink
        Packing: Tube

        DEFINITION
        OLCC (Organic Land Chip Carrier package):
        An AR glass-capped package of BT substrate.
        The excellent transmittance for the lighting and optical sensor device of the visible application.
        Package thickness is 1.31mm.

        RELIABILITY
        MSL Level JEDEC Level 4@ 245°C
        FEATURES
        • ● AR Glass
        • ● Visible and IR Application
        • ● BT Substrate
        • ● Full In-House Design Capability
        THERMAL PERFORMANCE
        Package Body Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        OLCC 38L 6x6 3.4x2.9 40.43
        Note: Simulated with JEDEC Standard 4-layer test board and 51-series under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)
        Frequency
        (MHz)
        Self Inductance
        (nH)
        Self Capacitance
        (pF)
        Resistance
        (mohm)
        OLCC 38L 6x6 100 0.353~3.597 0.357~5.933 13.647~113.470
        Note: Results are simulated. Data is available through 1GHz. Follow JEDEC standard 51-series.
        CROSS-SECTION