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      • COB
        Chip on Board Package

        DESCRIPTION

        Lingsen COB is a BT substrate based clear molding compound encapsulated package with body thickness of only 1.1/1.0/0.95/0.7mm. It is available in pin count from 4L to 30L or above in different body width and length.

        It is widely used in the packaging of photo-detector ICs.

        The package meets JEDEC Moisture Sensitivity Level 4 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness: 250um(10mils) maximum
        Substrate BT
        Die Attach 2100A/84-1 LMISR4
        Gold Wire 99.99% Au
        Mold Compound NT-309HQ/NT-310Q/NT-330HQ (Green)
        Plating Ni Au plated for soldering pad
        Marking White Ink
        Packing Antistatic Tube / Tray
        APPLICATIONS
        • ● Photo-detector
        • ● Amplifier for laser light
        • ● Pick up head for DVDRW/DVDRAM/CDRW systems
        		  
        RELIABILITY
        MSL Level JEDEC Level 4 @ 220°C
        Temperature Cycling 500 cycles (-40°C /85°C)
        Temperature & Humidity Test 1,000 hrs (60°C/90%RH)
        High Temperature Storage 100 hrs (85°C)
        FEATURES
        • ● Full in-house package and substrate design capability
        • ● Meet industrial particle/foreign material level requirements
        • ● Pin count range from 4L to 30L or above
        PACKAGE AVAILABILITY
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        COB 8L (3x3.5mm) 3x3.5 1.47x1.90 1.17x1.60 55.76
        COB 16L (5x4mm) 5x4 1.95x2.36 1.65x2.06 36.72
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        COB 8L(3x3.5mm) 3x3.5 1.47x1.90 100 0.29-0.51 0.23-0.48 17.9-22.4
        COB 16L(5x4mm) 5x4 1.95x2.36 100 0.50-1.40 0.30-0.61 22.8-39.5
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION