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      • XSON
        Extremely Small Outline No Lead Package

        DESCRIPTION

        Lingsen Quad Flat No-lead (QFN) package is a plastic encapsulated package with exterior leads around the bottom periphery of the package to provide short electrical connection to the PWB. The package also provides excellent thermal performance by having the die attach paddle exposed on the bottom of the package surface to provide efficient heat path when soldering directly to the PWB.

        		  
        SPECIFICATIONS
        Gold Wire 99.99% Au
        Mold Compound G770 (Green)
        Plating Matte Tin
        Marking Laser Mark
        Packing Antistatic Tube or Tray
        APPLICATIONS
        • ● Telecommunication Products, Cellular Phone Wireless LAN
        • ● Low to medium lead count packages Information appliances
        • ● Portable Products, PDA, Digital Camera, MP3 player, Pagers
        		  
        RELIABILITY
        MSL Level JEDEC Level 3 @ 260°C
        Pressure Cook Test 168 hrs (121°C,100%RH, 2atm
        Temperature Cycling 1,000 cycles (-65°C/+150°C)
        HAST 100 hrs (130°C, 85%RH)
        Temperature & Humidity Test 1,000 hrs (85°C, 85%RH)
        High Temperature Storage 1,000 hrs (150°C)
        FEATURES
        • ● Low package profile:≦1.10mm
        • ● BT substrate
        • ● Eutectic Sn63/Pb37 solder ball, Pb free solder option
        • ● ull in-house design capability
        		  
        DEFINITION
        • ● QFN (Quad Flat No-lead Package):
          Exterior leads are around the bottom periphery of the package
        • ● SON (Small Outline No-lead Package) :
          Exterior leads are only in the bottom dual side of the package
        • ● V type: Package thickness is 0.9 mm
          W type: Package thickness is 0.75 mm
        • ● U type : Package thickness is 0.55 mm
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja
        (°C/W)
        VQFN 16L 4x4 2.45x2.45 1.872x1.9545x0.36 26.4
        VQFN 48L 7x7 5.40x5.40 2.5x4.0x0.2286 10.1
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Frequency (MHz) Self Inductance (nH) Self Capacitance (pF) Resistance (mohm)
        VQFN 16L 4x4 2.45x2.45 100 0.5893~0.8255 0.1370~0.1583 48.13~169.9
        VQFN 48L 7x7 5.40x5.40 100 1.0840~2.4560 0.1605~0.2113 133.6~448.8
        Note:Results are simulated. Data is available through 100 MHz.
        CROSS-SECTION