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      • OTQFN
        Open Top Quad Flat No-lead Package

        DESCRIPTION

        LINGSEN’s Open Top Quad Flat No-lead (OTQFN) package is an exposed sensor/lighting area and plastic encapsulated package with exterior leads is around the bottom periphery of the package to provide short electrical connection to the PWB. The package also provides excellent thermal performance by having the die attach paddle exposed on the bottom of the package surface to provide efficient heat path when solder directly to the PWB.

        APPLICATIONS
        • ● Storage products
          DVD Reader
          Blue Ray DVD reader
        • ● MEMS products Pressure sensor
          Motion sensor
          Microphone
        • ● Optical products Ambient sensor
          CMOS camera
        		  
        SPECIFICATIONS
        Gold Wire 99.99% Au
        Mold Compound G770(Green)
        Plating Pre-plating (Ni/Pd/Au)
        Marking Laser
        Packing Antistatic Tube or Tray

        DEFINITION
        QFN (Quad Flat No-lead Package):
        Exterior leads are around the bottom periphery of the package
        V type: Package thickness is 0.9mm

        RELIABILITY
        MSL Level JEDEC Level 3 @ 260°C
        FEATURES
        • ● Reduce electrical parasitic
          Driven by high frequency for telecom
        • ● Lower thermal resistance
          Small conventional packages typically have poor thermal performance
        • ● Improved board space efficiency
          Not necessary chip scale
        • ● Reduced mounted height
        • ● Reduced package mass
          Handsets, PDAs
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        VQFN 16L 4x4 2.79x2.79 2.120x2.120x0.36 38.3
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        VQFN 16L 4x4 2.79x2.79 100 0.920~1.41 0.238~0.180 74.486~87.544
        Note:Results are simulated. Data is available through 1GHz. Follow JEDEC standard 51-series.
        CROSS-SECTION