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      • USP : Ultra Small Package

        UTS : Ultra Thin Small Package

        DESCRIPTION

        Lingsen Ultra Small & Thin Package (USP) is a plastic encapsulated package with exterior leads around the bottom periphery of the package to provide short electrical connection to the PWB. The sawing type package design offers dimension & manufacturing flexibility and reduce time to market effectively. It also reduces initial cost considerably and allows IC designs with any number of pins.

        The USP package meets JEDEC Moisture Sensitivity Level 1 standard that ensures reliability in its functions.

        APPLICATIONS
        • ● Telecommunication Products
          Cellular Phone, Wireless LAN
        • ● Low to medium lead count packages
        • ● Portable Products, PDAs, Digital Camera, MP3 Player, Pagers, Handsets
        		  
        SPECIFICATIONS
        1 Die Thickness

        200um (8 mil) maximum for USP , 150um (6 mil) maximum for UTS

        Gold Wire 99.99% Au
        Mold Compound EME-G770
        Plating Au-Ni-Au or Au-Ni(Ni: 50um Au: 0.3um)
        Marking Laser Mark
        Packing Tape & Reel or Canister

        DEFINITION
        • ● Exterior leads can be designed at the bottom periphery of the package or customerized design
        • ● Package thickness is 0.6 mm (MAX.) for USP and 0.5 mm (MAX.) for UTS
        RELIABILITY
        MSL Level JEDEC Level 1 @ 260°C
        Temperature Cycling Test 1000 cycles (-40°C/ 85°C)
        HAST 100 hrs (130°C, 85%RH)
        Temperature & Humidity Test 1,000 hrs (85°C, 85%RH)
        High Temperature Storage 1,000 hrs (150°C)
        Pressure Cooker Test 168 hrs (121°C, 2 atm , 100% RH)
        FEATURES
        • ● Improved board space efficiency
        • ● Package body size flexible by substrate design and reduce the size , thickness and weight.
        • ● Reduced mounted height and space
        • ● JEDEC MSL level 1 qualified
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja
        (°C/W)
        USP 6L 2.0x1.8 1.4x1.0 1.1x1.0x0.2 52.29
        USP 8L 2.0x2.0 1.8x0.7 0..4x0.47 / 0.65x0.52 68.91
        USP 12L 3.6x2.85 2.6x2.75 0.9x1.6 / 1.2x1.6 / 0.75x0.5 36.28
        USP 24L 4.0x4.0 2.84x2.84 1.95x2.5 / 0.64x0.6 35.77
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Frequency (MHz) Self Inductance (nH) Self Capacitance (pF) Resistance (mohm)
        USP 6L 1.8x2.0 1.4x1.0 100 0.583~0.746 0.074~0.081 63.49~73.78
        USP 8L 2.0x2.0 1.8x0.7 2500 0.506~0.908 0.059~0.083 195.12~282.75
        USP 12L   3.6x2.85 2500 0.474~1.197 0.050~0.086 118.65~344.73
        USP 24L 1.8x2.0 4.0x4.0 2500 0.317~1.298 0.077~0.862 88.263~403.36
        Note:Results are simulated. Data is available through 100 MHz.
        CROSS-SECTION