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      • LFBGA
        Low Profile , Fine Pitch Ball Grid Array Package


        DESCRIPTION

        Lingsen Mini-BGA is a cavity up, wire bonded and overmolded on BT substrate chip scale package. It offers small scale, light weight and cost saving solutions for low ball counts less than 300. It is suitable for portable and handheld products and can be one of your best choice. MiniBGA with a matrix format substrate and a common mold chase accommodates different package sizes to offer manufacturing flexibility and thus reduce time to market effectively.

        		  
        SPECIFICATIONS
        Die Thickness 250um(10mils) maximum
        Substrute Ablebond 8510AA / 2100A
        Gold Wire 25um(1.0mils) diameter 99.99% Au
        Mold Compound Shin-Etsu KMC-211AA Series (Non-Green)
            Sumitomo EME-G770 Series (Green)
        Solder Ball Sn63/Pb37, Sn/Ag/Cu
        Marking Laser Mark
        Packing Tray
        APPLICATIONS
        • ● Memory, Analog, Flash, ASICs
        • ● RF devices and simple PLDs
        • ● Cellular Phone, Notebook, PDAs and Wireless Systems
        		  
        RELIABILITY
        MSL Level JEDEC Level 3 @ 245°C
        Temperature Cycling 500 cycles (-65/150°C)
        Temperature & Humidity Test 1,000 hrs (85°C, 85%RH)
        High Temperature Storage 1,000 hrs (150°C)
        Thermal Shock Test 200 cycles (-55/125°C)
        Pressure Cook Test 168 hrs (121°C,100%RH, 2atm)
        FEATURES
        • ● Low package profile:≦1.10mm
        • ● BT substrate
        • ● Eutectic Sn63/Pb37 solder ball, Pb free solder option
        • ● ull in-house design capability
        THERMAL PERFORMANCE
        Body Size (mm) Ball Count Ball Pitch (mm) Thermal Ball Qity Die Size (mm) ja
        (°C/W)         		Substrate PCB
        6x8 36 0.75 0 2.905x4.085 55.891 2 4
        13x13 175 0.80 0 7x7 30.68 2 4

        ELECTRICAL PERFORMANCE
        Body Size Ball Count Substrate Layer L(nH) C(pF) R(mohm)
        6x6 49 2 3.36~1.212 0.797~0.332 177.7~75.74
        13x13 175 2 9.42~0.181 3.04~0.23 301~14.7
        Note:Results are simulated. Data is available through 100 MHz.
        CROSS-SECTION