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      • CSP
        Chip Scale Package

        DESCRIPTION

        Lingsen CSP package is a ceramic substrate based plastic package with body thickness of only 0.65mm. It is available in pin count from 4 to higher pin counts based on the size of designed substrate. It is ideal to be used in the packaging of RF, wireless, portable as well as high-end networking and computing application products.

        The package meets JEDEC Moisture Sensitivity Level 1 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness 100um (4mils) maximum
        Substrute Ceramic Substrute
        Gold Wire 99.99% Au
        Mold Compound Matsushita CV 8710J
        Plating Au Pluted for Soldering pad
        Marking Laser Mark
        Packing Bulk
        APPLICATIONS
        • ● RF/ Wireless/ Portable Products
        • ● Networking and Computing Application Products
        • ● SDR / DDR
        • ● Low Power SDRAMs
        		  
        RELIABILITY
        MSL Level : MSL 1 @ 240°C
        FEATURES
        • ● Low profile, 0.65mm height
        • ● Package body size is flexible by substrate design
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 1 qualified
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        1412 1.42x1.18 0.65x0.6 0.442x0.373 357.2
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        1412 1.42x1.18 0.65x0.6 100 0.17~0.58 0.11~0.20 13.07~51.75
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION