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      • TQFP
        Thin Quad Flat Package

        DESCRIPTION

        TQFP is a quad-sided lead frame based plastic package with body thickness of only 1.0mm. It is available in different body sizes and pin counts from 32L to 128L. The broad pin count range and body size choices of the TQFP make it a very versatile package for wide range of devices from ASIC, gate arrays to memory and mixed signal devices. Its low package profile is well suited for portable and consumer products that demands thin and light components.

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness 279um (11mils) maximum
        Gold Wire 99.99% Au
        Mold Compound EME G700 (Green)
            EME 7372 (Non-Green)
        Plating Matte Tin
        Marking White lnk / Laser Mark
        Packing Tray
        APPLICATIONS
        • ● DSP/ Base Band ICs
        • ● Gate Arrays
        • ● Logic/ ASIC
        • ● Micro-controllers/ Micro Processors
        • ● Chipsets/ Graphics Chip
        • ● Mixed Signal/ Analog ICs
        		  
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 500cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Available body from 7x7mm to 14x14mm
        • ● 32L to 128L lead counts
        • ● Thin body profile (1.0mm)
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 3 qualified for all pin counts
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        TQFP 32L 7x7 5.207x5.207 2.57x2.84 48.43
        TQFP 128L 14x14 6x6 3.009x3.074 36.31
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        TQFP 32L 7x7 5.207x5.207 100 2.325~3.323 0.391~0.448 86.53~210.8
        TQFP 128L 14x14 6x6 100 4.962~6.839 0.812~1.034 141.9~331.6
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION