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      • QFP
        Quad Flat Package

        DESCRIPTION

        QFP is a quad-sided, lead frame based plastic package. QFP family has broad pin count range and body size choices make them a very versatile package for wide range of devices from ASIC to chipsets and broadband IC controllers. Lingsen QFPs are offered in different body dimensions from 14x20mm to 28x28mm with thickness ranging from 2.8mm to 3.3mm (160L). Available pin counts are from 64L to 160L.

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness 762um (30mils) maximum
        Gold Wire 99.99% Au
        Mold Compound EME G600 (Green)
            EME 6600CSP (Non-Green)
        Plating Matte Tin
        Marking White lnk / Laser Mark
        Packing Tray
        APPLICATIONS
        • ● DSP/ Base Band ICs
        • ● Logic/ ASIC
        • ● Multimedia
        • ● Micro-Controllers/ Micro Processors
        • ● Chipsets/ Graphics Chip
        • ● Mixed Signal/ Analog ICs
        		  
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 500cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Available body from 14x20mm to 28x28mm
        • ● 64L to 160L lead counts
        • ● Body thickness 2.8mm to 3.3mm
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 3 qualified for all pin counts
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        QFP 64L 14x20 5.08x5.08 3.416x3.607 42.11
        QFP 208L 28x28 8x8 5.4x7.1 22.64
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        QFP 64L 14x20 5.08x5.08 100 6.229~8.677 0.847~1.258 259.7~287.4
        QFP 208L 28x28 8x8 100 9.811~13.18 1.251~2.561 383~493.2
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION