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PLCC
Plastic Leaded Chip Carrier Package |
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APPLICATIONS
- ● Consumer Products
- ● Copiers, Printers, Scanners, Computers, Monitors and etc.
- ● Memory ICs
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RELIABILITY
MSL Level: MSL 3 @ 240°C for Sn/Pb
MSL Level: MSL 3 @ 260°C for Pb-Free & Green
Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
Temperature Cycling: 1000cycles (-65°C/+150°C)
HAST: 100hrs (130°C, 85%RH)
Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
High Temperature Storage: 1,000hrs (150°C) |
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FEATURES
- ● Available pin count: 32L & 44L
- ● "J" ead format
- ● Broad selection of die pad sizes
- ● JEDEC standard compliant
- ● JEDEC MSL level 3 qualified for all pin counts
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THERMAL PERFORMANCE
| Package |
Body Size (mm) |
Pad Size (mm) |
Die Size (mm) |
Thermal Performance ja (°C/W) |
| PLCC 32L |
11.43x13.97 |
8.636x7.62 |
7.847x6.452 |
26.58 |
| PLCC 44L |
16.54x16.54 |
6.35x6.35 |
5.029x5.08 |
29.19 |
Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C |
ELECTRICAL PERFORMANCE
| Package |
Body Size
(mm) |
Pad Size
(mm) |
Frequency
(MHz) |
Self Inductance
(nH) |
Self Capacitance
(pF) |
Resistance
(mohm) |
| PLCC 32L |
11.43x13.97 |
8.636x7.62 |
100 |
1.377~5.910 |
0.864~5.477 |
7.058~359.3 |
| PLCC 44L |
16.54x16.54 |
6.35x6.35 |
100 |
2.993~6.878 |
1.219~1.470 |
20.57~241.6 |
Note:Results are simulated. Data is available through 2.5GHz. |
CROSS-SECTION
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