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      • TSOP II

        DESCRIPTION

        TSOP II is a lead frame based plastic package with body thickness of only 1.0mm. It is available in pin counts from 24L to 66L in different body lengths. It is widely used in the packaging of DRAMs from traditional EDO DRAMs to the cutting edge DDR SDRAMs.

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness 279um (11mils) maximum
        Gold Wire 99.99% Au
        Mold Compound CEL-9200HF-9SU (Green)
            KMC 260NCA (Non-Green)
        Plating Matte Tin
        Marking White lnk / Laser Mark
        Packing Tray
        APPLICATIONS
        • ● DDR SDRAM
        • ● Flash Memory
        • ● SDRAM
        		  
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 500cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Standard 400 mil wide body size
        • ● Pint count from 24L to 66L
        • ● Thin body profile (1.0mm)
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 3 qualified for all pin counts
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        TSOP II 28L 10.16x18.41 3.302x5.334 2.458x1.885 159.39
        TSOP II 54L 10.16x22.22 7x13.386 5.461x10.922 52.96
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        TSOP II 28L 10.16x18.41 3.302x5.334 100 1.687~7.441 0.548~2.065 72.17~457.6
        TSOP II 54L 10.16x22.22 7x13.386 100 0.914~4.969 0.416~0.734 70.81~321.1
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION