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      • TSOPI
        Thin Shrink Small Outline Package

        DESCRIPTION

        Lingsen TSOP I is a lead frame based plastic package with body thickness of only 1.0mm. It is available in different body sizes and pin counts from 28L to 56L. TSOP packages are ideal for packaging Flash, EEPROMs and SRAMs in consumer and portable electronic applications such as Cell Phone and PDAs.

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness 279um (11mils) maximum
        Gold Wire 99.99% Au
        Mold Compound EME G700 (Green)
            EME 7372 (Non-Green)
        Plating Matte Tin
        Marking White lnk / Laser Mark
        Packing Tray
        APPLICATIONS
        • ● Memory + ASIC/Logic device using MCP
        • ● Flash Memory
        • ● SRAM/ Fast SRAM
        • ● EEPROM
        		  
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 1,000cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Thin body profile (1.0mm)
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 3 qualified for all pin counts
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        TSOP I 28L 11.8x8 10.278x5.08 5.649x4.229 57.63
        TSOP I 56L 18.4x14 10.244x8.2 9.74x7.7 44.8
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        TSOP I 28L 11.8x8 10.278x5.08 100 3.072~3.584 0.363~0.462 216.5~344.8
        TSOP I 56L 18.4x14 10.24x8.2 100 2.03~5.09 0.787~2.18 38.4~193
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION