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      • SSOP
        Shrink Small Outline Package

        DESCRIPTION

        Lingsen SSOP is a lead frame based plastic package with different body width of 150mil, 209mil and 300mil. It is available in different pin counts from 8L to 48L. SSOP packages are ideal for packaging Logic, Memory and Analog products in consumer and portable electronic applications.

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Die Thickness  
          With down-set 457um (18mils) maximum
          Without down-set 304um (12mils) maximum
        Gold Wire 99.99% Au
        Mold Compound EME G600 (Green)
            EME 6600CSP (Non-Green)
        Plating Matte Tin
        Marking White lnk / Laser Mark
        Packing Antistatic Tube
        APPLICATIONS
        • ● Amplifiers, Controllers
        • ● Logic, Linear, Analog, Memory
        • ● Consumer products: Pagers, Portable Devices
        • ● RF devices / Components
        		  
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 500cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Available pin count from 8L to 48L
        • ● Ink/Laser marking available
        • ● Gull wing lead format
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 3 qualified for all pin counts
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        SSOP 16L 3.91x4.8514 2.286x2.286 1.595x1.605 71.96
        SSOP 48L 7.49x15.88 3.81x3.81 1.68x1.64 49.65
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        SSOP 16L 3.91x4.8514 2.286x2.286 100 2.011~2.718 0.358~0.439 134.4~203.6
        SSOP 48L 7.49x15.88 3.81x3.81 100 3.46~7.304 0.563~1.195 122.9~250.9
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION