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      • SOP
        Small Outline Package

        DESCRIPTION

        Lingsen SOP package is designed to accommodate a wide variety of chip into industry accepted dimensions, allowing excellent SMT performance. SOIC is a mature lead frame based plastic encapsulated package with gull wings on two opposing longer sides of a rectangular body with different body sizes and pin counts from 8L to 44L.

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		  
        SPECIFICATIONS
        Max Die Thickness  
          Narrow Body with down-set 457um (18mils)
          Narrow Body without down-set 304um (12mils)
          Wide Body 762um (30mils)
          Power Pad 762um (30mils)
        Gold Wire 99.99% Au
        Mold Compound EME G600 (Green)
            EME 6600 CSP (Non-Green)
        Plating Matte Tin
        Marking White lnk/Laser Mark
        Packing Antistatic Tube
        APPLICATIONS
        • ● Consumer (Audio/ Video / Entertainment)
        • ● Telecom (Pagers/ Cordless Phones)
        • ● RF, CATV
        • ● Office Applications (Fax/ Copiers/ Printers)
        		  
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 1000cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Available pin count from 8L to 44L
        • ● Ink/ Laser marking available
        • ● Gull wing lead format
        • ● JEDEC standard outlines
        • ● JEDEC MSL level 3 qualified for all pin counts
        THERMAL PERFORMANCE
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        SOP 8L 5.28x5.28 3.556x4.064 1.244x3.12 85.54
        SOP 44L 12.6x28.5 8.128x8.636 5.5x4.79 35.05
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        SOP 8L 5.28x5.28 3.556x4.064 100 2.453~4.056 0.459~0.521 89.42~261.3
        SOP 44L 12.6x28.5 8.128x8.636 100 7.693~17.19 0.625~1.477 328.8~603.8
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION