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      • MSOP

        Mini Small Outline Package

        DESCRIPTION

        Lingsen MSOP is a lead frame based plastic encapsulated package with available pin count 8L & 10L. MSOP is for applications requiring thin, small, and high reliability. This package offers a smaller footprint, shorter wires for improved electrical connections and better moisture reliability (MRT/MSL).

        The package meets JEDEC Moisture Sensitivity Level 3 standard that ensures reliability in its functions.

        		 
        SPECIFICATIONS
        Die Thickness:  
          Normal 228um (0mils) maximum
          Power Pad 381um (15mils) maximun
        Gold Wire EME 99.99% Au
        Mold Compound EME G700 (Green)
            KMC 184 (Non-Green)
        Plating Matte Tin, PPF (ni Pd Au)
        Marking Laser Mark
        Packing Antistatic Tube / Tape & Reel
        APPLICATIONS
        • ● Analog and Operation Amplifiers
        • ● Controllers and Drivers
        • ● Logic, Memory, and RF/Wireless
        • ● Disk Drivers, Video/Audio and Consumer Appliances
        		 
        RELIABILITY
        MSL Level: MSL 3 @ 240°C for Sn/Pb
        MSL Level: MSL 3 @ 260°C for Pb-Free & Green
        Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
        Temperature Cycling: 1000cycles (-65°C/+150°C)
        HAST: 100hrs (130°C, 85%RH)
        Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
        High Temperature Storage: 1,000hrs (150°C)
        FEATURES
        • ● Body size 3x3mm
        • ● Available pin count 8L & 10L
        • ● Lead pitch 0.65mm and 0.5mm
        • ● Thermal enhancements (exposed pad) and regular types available
        • ● JEDEC standard compliant
        • ● JEDEC MSL level 3 qualified for all pin counts
        PACKAGE AVAILABILITY
        Package Body Size (mm) Pad Size (mm) Die Size (mm) Thermal Performance ja (°C/W)
        MSOP 8L 3x3 1.727x2.3876 0.762x1.016 172.84
        MSOP 10L 3x3 1.727x2.3876 1.2x1.82 165.12
        Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C
        ELECTRICAL PERFORMANCE
        Package Body Size
        (mm)        		 Pad Size
        (mm)        		 Frequency
        (MHz)        		 Self Inductance
        (nH)        		 Self Capacitance
        (pF)        		 Resistance
        (mohm)
        MSOP 8L 3x3 1.727x2.3876 100 1.274~2.346 0.275~0.34 72.32~130.6
        MSOP 10L 3x3 1.727x2.3876 100 1.166~1.667 0.255~0.316 48.26~114.1
        Note:Results are simulated. Data is available through 2.5GHz.
        CROSS-SECTION