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      • Test Items Equipment List
        Test Items
        Test Item Method Test Condition ( Standard ) Sample Size
        1.
        		 Precondition for Reliability Test Level 3 ( Min ) JESD 22-A113 Level 3 TC 5 cycles,bake 125°C,24H,Moisture Sock 30°C/60%R.H./192hrs,IR Reflow 3 cycles ( SMDs ) N=125
        AC=0,RE=1
        2.
        		 High Temperature Storage Test JESD22-A103 150°C,1000hrs N=22
        AC=0,RE=1
        3.
        		 Pressure Cooker Test JESD22-A102 121°C,2atm,100%R.H.,168hrs N=22
        AC=0,RE=1
        4.
        		 Temperature & Humidity Test JESD22-A101 85°C/85%R.H.,1000hrs N=22
        AC=0,RE=1
        5.
        		 Temperature Cycling Test JESD22-A104 -65°C~+150。c/15min,500cycles N=22
        AC=0,RE=1
        6.
        		 HAST JESD22-A110 130°C,85%R.H.,100hrs N=22
        AC=0,RE=1
        7.
        		 Moisture Sensitivity Test J-STD-020 Bake 24H,Moisture Sock,IR Reflow N=22/level
        AC=0,RE=1
        8.
        		 Solderability Test JESD22-B102 Dip&Look:Aging 8hrs,245±5°C,5±0.5sec
        Reflow Simulate use testing        		 N=5/method
        AC=0,RE=1
        9.
        		 Mark Permanency Test JESD22-B107 Tape:3M Tape
        JESD 22-B107 SOLVENT C        		 N=5/method
        AC=0,RE=1
        10.
        		 Physical Dimensions JESD22-B100 Per Outline Drawing N=5
        AC=0,RE=1
        11.
        		 Lead Fatigue Ted JESD22-B105 90°C,8oz for P-DIP/SKINNY
        3oz for SOP/SOJ/PLCC/QFP
        2oz for SSOP/TSOP/TSSOP/SOT and others        		 N=5
        AC=0,RE=1
        12.
        		 Resistance to Solder JESD22-B106 260°C,10sec,only for through-hole devices N=22
        AC=0,RE=1
        Equipment List
        Equipment Manufacturer Model Test Range
        1.
        		 Temp. Humi. Chamber
        WEISS
        SB22/300
        		 -40~+180°C( ±0.1~±0.5K), 10~98%R.H. ( ±1~±3%)
        2.
        		 Temp. Humi. Chamber
        WEISS
        SB/222/300
        		 -10~+95°C( ±0.1~±0.5K), 10~98%R.H. ( ±1~±3%)
        3.
        		 Temperature Cycling
        WEISS
        TS130
        Heat Chamber 60~200°C
        Cool Chamber-10~-80°C ( ±1K)
        4.
        		 Pressure Cooker
        HIRAYAMA
        PC-305S
        		 105~158°C ( ±1°C), 100% R.H.only, 0~5kg/cm2G
        5.
        		 HAST
        HIRAYAMA
        PC-422R5E
        		 105~149.7°C ( ±1°C), 65-100% R.H.(±3 R.H.), 0.2~2.1kg/cm2G
        6.
        		 Oven
        C-SUN
        QMO-2
        		 50~175°C(±1.5%)
        7.
        		 Oven
        C-SUN
        SMO-1
        		 50~200°C(±1.5%)
        8.
        		 Solder Pot
        FORTANE
        CY-330
        		 100~500°C(±1.5%)
        9.
        		 Steam Aging Tester
        CENI
        SAT-100
        		 98°C
        10.
        		 IR Reflow
        TANG TECK
        SMD-10-M10HA
        		 5 heat zone
        11.
        		 Weighting Machine
        SHIMADZU
        AX-120
        		 Max. 120g,+/-0.1mg
        12.
        		 Deionized Water System
        YEMAY
        SUPER H2O
        		 60 liter/hour
        13.
        		 Cooling System
        DONYEN
        PU0537C
        		 15~25°C
        14.
        		 Lead Fatigue Tester
        HYBRID
        1500
        		 2oz~8oz
        15.
        		 Open/Short Tester
        ETERNAL
        ETS950
        		 192 pins Max
        16.
        		 Scanning Acoustic Microscopy
        SONIX
        HS1000
        		 15MHz,25MHz,75MHz