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APPLICATIONS
- ● DSP/ Base Band ICs
- ● Logic/ ASIC
- ● Micro-controllers/ Micro Processors
- ● Chipsets/ Graphics Chip
- ● Mixed Signal/ Analog ICs
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RELIABILITY
MSL Level: MSL 3 @ 240°C for Sn/Pb
MSL Level: MSL 3 @ 260°C for Pb-Free & Green
Pressure Cook Test: 168hrs (121°C, 100%RH, 2atm)
Temperature Cycling: 500cycles (-65°C/+150°C)
HAST: 100hrs (130°C, 85%RH)
Temperature & Humidity Test: 1,000hrs (85°C, 85%RH)
High Temperature Storage: 1,000hrs (150°C) |
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FEATURES
- ● Available body from 7x7mm to 20x20mm
- ● 44L to 176L lead counts
- ● Body thickness 1.4mm
- ● JEDEC standard compliant
- ● JEDEC MSL level 3 qualified for all pin counts
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THERMAL PERFORMANCE
| Package |
Body Size (mm) |
Pad Size (mm) |
Die Size (mm) |
Thermal Performance ja (°C/W) |
| LQFP 44L |
10x10 |
5.207x5.207 |
4.406x4.711 |
45.03 |
| LQFP 176L |
20x20 |
7.112x7.112 |
3.9x4.4 |
38.19 |
Note:Simulated with JEDEC Standard 4-layer test board under still air condition, ambient temperature 45°C |
ELECTRICAL PERFORMANCE
| Package |
Body Size
(mm) |
Pad Size
(mm) |
Frequency
(MHz) |
Self Inductance
(nH) |
Self Capacitance
(pF) |
Resistance
(mohm) |
| LQFP 44L |
10x10 |
5.207x5.207 |
100 |
2.343~3.701 |
0.484~0.559 |
60.18~159.9 |
| LQFP 176L |
20x20 |
7.112x7.112 |
100 |
7.043~8.917 |
0.987~1.38 |
230.3~446.4 |
Note:Results are simulated. Data is available through 2.5GHz. |
CROSS-SECTION
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