菱生精密工業股份有限公司- 封裝服務 - Package Characterization

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- - Assembly Services
  - Product Services
    
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    Package Characterization

Package Characterization

	MSOP TSOPI SOP TSSOP

	LQFP PLCC TQFP

	CSP LFBGA MBGA WFBGA USP/UTS OTQFN UQFN VQFN VSON WQFN XQFN X2QFN XSON

	COB OLCC OPLGA IDIP AIO DMA SMA

	SC SOT2X SOT223 SOT89 TO92

	LTCC CLCC SiP

	MMIC

	DIP/SOP MPS

	TOLL IPM IGBT

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- - 菱生精密工業股份有限公司Lingsen Precision Industries , Ltd.
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