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      • 2022 Jun. The Company received ISO14064:2018 the revision certification on Environmental Management Systems.
        2022 Jun. The Company received SONY Green Partner certification, and the expiry date till September, 2025.
        2021 Jan. The Company received ISO 9001:2015 certification on Quality Management System, and the expiry date till January, 2024.
        2021 Jan. The Company received IATF 16949:2016 certification on Quality Management System, and the expiry date till January, 2024.
        2020 Sep. The Company received ISO14001:2015 the revision certification on Environmental Management Systems, and the expiry date till September, 2023.
        2020 Jan. Ningbo Liyuan (Mainland China) Technology Co.,Ltd. received ISO 9001:2015 certification.
        2019 Jun. The Company's Board of Directors appointed Mr. Tse-Sung Tsai as the President of The Company.
        2019 Jun. The Company received the renewed certificates of SONY Green Partner.
        2018 Sep. Lingsen got certificate of ISO14001：2015 Environmental Management System.
        2018 Feb. Lingsen got certificate of IATF 16949 Quality Management System.
        2015 Dec. The staff quarters of the Chungkang Export Processing Zone, EPZA, MOEA were completed and the bronze certification of the Taiwan Green Building Council was obtained.
        2015 Jan. New factory Obtained「LEED Certification」.
        2014 Mar. Factory at Chungkang Export Processing Zone completed.
        2013 Dec. Purchased factories No. 5-2-1, 5-3, 5-4, 12, 14, 16, and 18, S. 2nd Rd., Tanzi Dist.
        2012 Oct. Obtained NT$1.5 million subsidy from the "Improvement Encouragement of Private Building Intellectualization" project by the Architecture and Building Research Institute of the Ministry of the Interior".
        2011 Dec. New factory in the Chungkang Export Processing Zone approved by resolution of the Board of Directors.
        2009 Nov. Obtained OHSAS 18001 certification.
        2008 Jan. Production of UQFN/SON (0.55mm) package begins.
          Apr. Production of XQFN/SON (0.45mm) package begins.
          Jun. Production of TQFN (1.15mm) package begins.
        2007 Jan. Production of USP、LGA、UFD package begins.
        Jan. Production of Halogen Free package begins.
        Mar. Production of UTS package begins.
        2006 Feb Production of Micro_ SD,MEM_MIC,OLCC,LTCC, QFN, and Shrink OPLGA/FLGA packaging begins.
        2005 Mar Lingsen got certificate of ISO/TS16949
        2004 Aug Production of QFN, SON and SC-82 packaging begins.
        2003 Feb

        Production of COB, TSOT-2X packaging begins

        2002 Feb. Production of CSP packaging begins.
          Jul. Production of Pb-free packaging begins.
        2001 Oct. Production of PD-IC packaging begins.
        1999 Jul. Lingsen receives QS-9000 certification from UL International Services LTD.
        1998 Jan. Passed the Initial Application for Listing securities by the Taiwan Stock Exchange.
          Apr. Listed on the Taiwan Stock Exchange.
          Jul. Lingsen receives ISO-14001 certification from UL International Services LTD.
        1995 Jul. S.E.C. approved Lingsen stock public offering plan.
          Jul. Lingsen receives ISO-9002 certification from the Bureau of Commodity inspection and Quarantine of Taiwan's Ministry of Economic Affairs.
        1991 Sep. QFP developed and begins mass production.
        1990 Nov. SOJ developed and begins mass production.
        1989 Aug. Lingsen enters into technology cooperation agreement with Mitsubishi for packaging of integrated circuits.
          Oct. Zip developed and begins mass production.
        1987 Feb. EEPROM test begins mass production.
        1985 Mar. Production of PLCC, SOIC, 64K DRAM packaging begins.
        1984 Mar. Lingsen begins developing the US market.
        1983 Apr. Lingsen collaborates with Taiwan's Electronics Research Institute and United Microelectronics Corp. on developing Taiwan's semiconductor industry.
        1980 Jan. Lingsen enters into technology cooperation agreement with Mitsubishi for production of IC wafers and begins sales.
        1977 May. Lingsen finishes development and begins production of photo-electric products, solar batteries, and light emitting diodes.
        1976 Mar. Lingsen adds IC wafer products to its product lines and receives Mitsubishi's commission to export them to Japan.
        1973 Jul. Lingsen Precision Industries is founded with initial capitalization of NT$ 8 million in Taichung Export Processing Zone
          Jul. Lingsen is commissioned by Japan's Mitsubishi Corp. to export products to Japan.