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      • 1973 Jul. Lingsen Precision Industries is founded with initial capitalization of NT$ 8 million in Taichung Export Processing Zone
          Jul. Lingsen is commissioned by Japan's Mitsubishi Corp. to export products to Japan.
        1976 Mar. Lingsen adds IC wafer products to its product lines and receives Mitsubishi's commission to export them to Japan.
        1977 May. Lingsen finishes development and begins production of photo-electric products, solar batteries, and light emitting diodes.
        1980 Jan. Lingsen enters into technology cooperation agreement with Mitsubishi for production of IC wafers and begins sales.
        1983 Apr. Lingsen collaborates with Taiwan's Electronics Research Institute and United Microelectronics Corp. on developing Taiwan's semiconductor industry.
        1984 Mar. Lingsen begins developing the US market.
        1985 Mar. Production of PLCC, SOIC, 64K DRAM packaging begins.
        1987 Feb. EEPROM test begins mass production.
        1989 Aug. Lingsen enters into technology cooperation agreement with Mitsubishi for packaging of integrated circuits.
          Oct. Zip developed and begins mass production.
        1990 Nov. SOJ developed and begins mass production.
        1991 Sep. QFP developed and begins mass production.
        1995 Jul. S.E.C. approved Lingsen stock public offering plan.
          Jul. Lingsen receives ISO-9002 certification from the Bureau of Commodity inspection and Quarantine of Taiwan's Ministry of Economic Affairs.
        1998 Jan. Passed the Initial Application for Listing securities by the Taiwan Stock Exchange.
          Apr. Listed on the Taiwan Stock Exchange.
          Jul. Lingsen receives ISO-14001 certification from UL International Services LTD.
        1999 Jul. Lingsen receives QS-9000 certification from UL International Services LTD.
        2001 Oct. Production of PD-IC packaging begins.
        2002 Feb. Production of CSP packaging begins.
          Jul. Production of Pb-free packaging begins.
        2003 Feb

        Production of COB, TSOT-2X packaging begins

        2004 Aug Production of QFN, SON and SC-82 packaging begins.
        2005 Mar Lingsen got certificate of ISO/TS16949
        2006 Feb Production of Micro_ SD,MEM_MIC,OLCC,LTCC, QFN, and Shrink OPLGA/FLGA packaging begins.
        2007 Jan. Production of USP、LGA、UFD package begins.
        Jan. Production of Halogen Free package begins.
        Mar. Production of UTS package begins.
        2008 Jan. Production of UQFN/SON (0.55mm) package begins.
          Apr. Production of XQFN/SON (0.45mm) package begins.
          Jun. Production of TQFN (1.15mm) package begins.